Direct stamping of silver nanoparticles toward residue-free thick electrode.

PubWeight™: 0.75‹?›

🔗 View Article (PMID 27877492)

Published in Sci Technol Adv Mater on June 13, 2012

Authors

Jiseok Kim1, Kevin Wubs1, Byeong-Soo Bae2, Woo Soo Kim1

Author Affiliations

1: Mechatronic Systems Engineering, School of Engineering Science, Simon Fraser University, Surrey, BC V3T 0A3, Canada.
2: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea.